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21 April 2006 Compact triangulation sensor realized by bending wafer with metal hinge
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Abstract
A triangulation distance sensor is constructed bending the wafer with metal hinges. On the Si wafer, elements are pre-aligned at the planer condition using the photolithography. The position sensitive detector (PSD), mirror, and alignment pit for a ball lens are prepared. 3-sensor array is integrated in 20x17x10 mm3 size. Compared with our previous study using polymer, the metal hinge stabilizes the long-term performance and the process. Optical elements including LD chip are all included on the wafer. The demonstrated measurement range is 18-40 mm.
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Minoru Sasaki, Satoshi Endou, Masayuki Fujishima, and Kazuhiro Hane "Compact triangulation sensor realized by bending wafer with metal hinge", Proc. SPIE 6186, MEMS, MOEMS, and Micromachining II, 618606 (21 April 2006); https://doi.org/10.1117/12.662466
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