Thermal-impedance simulations of antenna-coupled microbolometers

Francisco J. González

doi:10.1117/12.663439

17 May 2006 Thermal-impedance simulations of antenna-coupled microbolometers

Francisco J. González

Proceedings Volume 6206, Infrared Technology and Applications XXXII; 62061D (2006) https://doi.org/10.1117/12.663439
Event: Defense and Security Symposium, 2006, Orlando (Kissimmee), Florida, United States

Abstract

Antenna-coupled microbolometers have shown characteristics that makes them a promising option for fast-frame-rate infrared-imaging applications, however commercial application of these type of devices is only possible if a substantial increase in their responsivity is achieved. Due to the fabrication requirements of these detectors the process of optimizing them becomes extremely expensive and time consuming. In this paper a finite-element-based simulation approach to optimize the design of thermally isolated microbolometers is presented and the particular case of a bowtie-coupled microbolometer on a silicon nitride membrane is analyzed. The thermal impedance simulations performed indicate that a responsivity increase of at least a factor of 6× can be obtained by optimizing the membrane shape and the materials used for the bias lines, this would lead to values of D* close to 1×10⁹ cm√Hz/W if applied to devices reported in the literature, which would close the gap between the responsivity of antenna-coupled detectors and detectors used in commercial infrared imaging systems.

Citation Download Citation

Francisco J. González "Thermal-impedance simulations of antenna-coupled microbolometers", Proc. SPIE 6206, Infrared Technology and Applications XXXII, 62061D (17 May 2006); https://doi.org/10.1117/12.663439

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KEYWORDS

Microbolometers

Silicon

Sensors

Gold

Infrared sensors

Antennas

Bolometers

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