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16 June 2006 Far infrared through millimeter backshort-under-grid arrays
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Abstract
We are developing a large-format, versatile, bolometer array for a wide range of infrared through millimeter astronomical applications. The array design consists of three key components - superconducting transition edge sensor bolometer arrays, quarter-wave reflective backshort grids, and Superconducting Quantum Interference Device (SQUID) multiplexer readouts. The detector array is a filled, square grid of bolometers with superconducting sensors. The backshort arrays are fabricated separately and are positioned in the etch cavities behind the detector grid. The grids have unique three-dimensional interlocking features micromachined into the walls for positioning and mechanical stability. The ultimate goal of the program is to produce large-format arrays with background-limited sensitivity, suitable for a wide range of wavelengths and applications. Large-format (kilopixel) arrays will be directly indium bump bonded to a SQUID multiplexer circuit. We have produced and tested 8×8 arrays of 1 mm detectors to demonstrate proof of concept. 8×16 arrays of 2 mm detectors are being produced for a new Goddard Space Flight Center instrument. We have also produced models of a kilopixel detector grid and dummy multiplexer chip for bump bonding development. We present detector design overview, several unique fabrication highlights, and assembly technologies.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Christine A. Allen, John Abrahams, Dominic J. Benford, James A. Chervenak, David T. Chuss, Johannes G. Staguhn, Timothy M. Miller, S. Harvey Moseley, and Edward J. Wollack "Far infrared through millimeter backshort-under-grid arrays", Proc. SPIE 6275, Millimeter and Submillimeter Detectors and Instrumentation for Astronomy III, 62750B (16 June 2006); https://doi.org/10.1117/12.672125
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