0.250mm-thick CCD packaging for the Dark Energy Survey Camera array

Gregory Derylo; H. Thomas Diehl; Juan Estrada

doi:10.1117/12.672505

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5 June 2006 0.250mm-thick CCD packaging for the Dark Energy Survey Camera array

Gregory Derylo, H. Thomas Diehl, Juan Estrada

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Proceedings Volume 6276, High Energy, Optical, and Infrared Detectors for Astronomy II; 627608 (2006) https://doi.org/10.1117/12.672505
Event: SPIE Astronomical Telescopes + Instrumentation, 2006, Orlando, Florida , United States

Abstract

The Dark Energy Survey Camera focal plane array will consist of 62 2k x 4k CCDs with a pixel size of 15 microns and a silicon thickness of 250 microns for use at wavelengths between 400 and 1000 nm. Bare CCD die will be received from the Lawrence Berkeley National Laboratory (LBNL). At the Fermi National Accelerator Laboratory, the bare die will be packaged into a custom back-side-illuminated module design. Cold probe data from LBNL will be used to select the CCDs to be packaged. The module design utilizes an aluminum nitride readout board and spacer and an Invar foot. A module flatness of 3 microns over small (1 sqcm) areas and less than 10 microns over neighboring areas on a CCD are required for uniform images over the focal plane. A confocal chromatic inspection system is being developed to precisely measure flatness over a grid up to 300 x 300 mm. This system will be utilized to inspect not only room-temperature modules, but also cold individual modules and partial arrays through flat dewar windows.

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Gregory Derylo, H. Thomas Diehl, and Juan Estrada "0.250mm-thick CCD packaging for the Dark Energy Survey Camera array", Proc. SPIE 6276, High Energy, Optical, and Infrared Detectors for Astronomy II, 627608 (5 June 2006); https://doi.org/10.1117/12.672505

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