Characterizing the response of an EUV reticle during electrostatic chucking

Roxann L. Engelstad; Edward G. Lovell; Andrew R. Mikkelson; Madhura Nataraju; Vasu Ramaswamy; Jaewoong Sohn; Gerald A. Dicks; Amr Y. Abdo; Richard O. Tejeda

doi:10.1117/12.692727

21 June 2006 Characterizing the response of an EUV reticle during electrostatic chucking

Roxann L. Engelstad, Edward G. Lovell, Andrew R. Mikkelson, Madhura Nataraju, Vasu Ramaswamy, Jaewoong Sohn, Gerald A. Dicks, Amr Y. Abdo, Richard O. Tejeda

Author Affiliations +

Proceedings Volume 6281, 22nd European Mask and Lithography Conference; 628107 (2006) https://doi.org/10.1117/12.692727
Event: 22nd European Mask and Lithography Conference, 2006, Dresden, Germany

Abstract

Extreme Ultraviolet Lithography (EUVL) is one of the leading candidates for Next-Generation Lithography in the sub-45-nm regime. One of the key components in the development of EUVL is understanding and characterizing the response of the mask when it is electrostatically chucked in the exposure tool. In this study, finite element (FE) models have been developed to simulate the reticle / chuck system under typical exposure conditions. FE simulations are used to illustrate (a) the effects of the nonflatness of the reticle and chuck, (b) the image placement errors induced by back-side particulates, (c) the influence of the coefficient of friction between the reticle and chuck during exposure scanning, and (d) the effects of contact conductance on the thermomechanical response of the reticle. The focus of this paper is to illustrate that mechanical modeling and simulation has now become a fundamental tool in the design of electrostatic pin chucks for the EUVL technology.

Citation Download Citation

Roxann L. Engelstad, Edward G. Lovell, Andrew R. Mikkelson, Madhura Nataraju, Vasu Ramaswamy, Jaewoong Sohn, Gerald A. Dicks, Amr Y. Abdo, and Richard O. Tejeda "Characterizing the response of an EUV reticle during electrostatic chucking", Proc. SPIE 6281, 22nd European Mask and Lithography Conference, 628107 (21 June 2006); https://doi.org/10.1117/12.692727

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available