Translator Disclaimer
Paper
21 June 2006 Plasma deposited and evaporated thin resists for template fabrication
Author Affiliations +
Proceedings Volume 6281, 22nd European Mask and Lithography Conference; 62810O (2006) https://doi.org/10.1117/12.692742
Event: 22nd European Mask and Lithography Conference, 2006, Dresden, Germany
Abstract
In this paper, we demonstrate electron beam lithography at energies ranging from 2 keV to 100 keV, on sub-100 nm thick resists. Such uniform and thin electron beam sensitive films can be deposited by evaporation or by plasma deposition. Two examples of such resists are studied, QSR-5 which is a negative sterol based evaporated resist and QPR-P50 which is a positive PECVD deposited fluoropolymer resist. AFM measurements demonstrate surface roughness smaller then 3 nm for QSR-5 and 0.7 nm for QPR-P50. In both cases, 50 nm features or better are patterned using electron beam lithography on a template blank consisting of a glass substrate, coated with a 10 nm thick Cr transfer layer and a resist layer. LER (3σ) is measured to be less then 8% for 50 nm wide lines in QSR-5 and of approx. 10% for 50 nm wide lines in QPR-P50.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Eric Lavallée, Jacques Beauvais, Bertrand Takam Mangoua, and Dominique Drouin "Plasma deposited and evaporated thin resists for template fabrication", Proc. SPIE 6281, 22nd European Mask and Lithography Conference, 62810O (21 June 2006); https://doi.org/10.1117/12.692742
PROCEEDINGS
6 PAGES


SHARE
Advertisement
Advertisement
Back to Top