Automatic pitch decomposition for improved process window when printing dense features at k<sub>1</sub>eff<0.20

Judy Huckabay; Wolf Staud; Robert Naber; Mircea Dusa; Donis Flagello; Robert Socha

doi:10.1117/12.681853

20 May 2006 Automatic pitch decomposition for improved process window when printing dense features at k₁eff<0.20

Judy Huckabay, Wolf Staud, Robert Naber, Mircea Dusa, Donis Flagello, Robert Socha

Proceedings Volume 6283, Photomask and Next-Generation Lithography Mask Technology XIII; 62830T (2006) https://doi.org/10.1117/12.681853
Event: Photomask and Next Generation Lithography Mask Technology XIII, 2006, Yokohama, Japan

Abstract

In conventional IC processes, the smallest size of any features that can be created on a wafer is severely limited by the pitch of the processing system. This approach is a key enabler of printing mask features on wafers without requiring new manufacturing equipment and with minor changes to existing manufacturing processes. The approach also does not require restrictions on the design of the chip. This paper will discuss the method and full-chip decomposition tool used to determine locations to split the layout. It will demonstrate examples of over-constrained layouts and how these configurations are mitigated. It will also show the reticle enhancement techniques used to process the split layouts and the Lithographic Checking used to verify the lithographic results.

Citation Download Citation

Judy Huckabay, Wolf Staud, Robert Naber, Mircea Dusa, Donis Flagello, and Robert Socha "Automatic pitch decomposition for improved process window when printing dense features at k₁eff<0.20", Proc. SPIE 6283, Photomask and Next-Generation Lithography Mask Technology XIII, 62830T (20 May 2006); https://doi.org/10.1117/12.681853

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