Translator Disclaimer
Paper
14 August 2006 High-speed high-accuracy fiber optic low-coherence interferometry for in situ grinding and etching process monitoring
Author Affiliations +
Abstract
We present design of novel tool for characterization of wafer thickness and wafer topography employing fast low coherence fiber optic interferometer, which optical length of the reference arm of the interferometer is monitored by secondary long coherence length interferometer.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Wojciech J. Walecki, Alexander Pravdivtsev, Manuel Santos II, and Ann Koo "High-speed high-accuracy fiber optic low-coherence interferometry for in situ grinding and etching process monitoring", Proc. SPIE 6293, Interferometry XIII: Applications, 62930D (14 August 2006); https://doi.org/10.1117/12.675592
PROCEEDINGS
5 PAGES


SHARE
Advertisement
Advertisement
RELATED CONTENT


Back to Top