Paper
20 October 2006 Feasibility study of mask fabrication in double exposure technology
Author Affiliations +
Abstract
With decreasing the design node, there are some candidates for the optical lithography technology. Double Exposure Technology (DET) is the one of the solution to extend the resolution limit down to k1 less than 0.25 for the next generation devices. To accomplish DET, photomask MTT, CD uniformity, and the overlay between the layers for the dual exposure are important as the photomask process aspect. MTT and CD uniformity have been frequently discussed for Single Exposure Technology (SET), but the overlay and the registration have not been discussed yet with the view of DET. In this work, the feasibility of mask fabrication, especially the overlay and the registration for DET are analyzed. The current mask limit of DET is discussed considering MTT, uniformity, and overlay.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jong Gul Doh, Sang Hee Lee, Je Bum Yoon, Doo Youl Lee, Seong Yong Cho, Byung Gook Kim, Seong Woon Choi, and Woo Sung Han "Feasibility study of mask fabrication in double exposure technology", Proc. SPIE 6349, Photomask Technology 2006, 63491U (20 October 2006); https://doi.org/10.1117/12.686523
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CITATIONS
Cited by 2 scholarly publications.
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KEYWORDS
Photomasks

Overlay metrology

Image registration

Semiconducting wafers

Thermal effects

Error analysis

Mask making

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