Real-time ultra-sensitive ambient ammonia monitor for advanced lithography

Eric Crosson; Katsumi Nishimura; Yuhei Sakaguchi; Chris W. Rella; Edward Wahl

doi:10.1117/12.692934

20 October 2006 Real-time ultra-sensitive ambient ammonia monitor for advanced lithography

Eric Crosson, Katsumi Nishimura, Yuhei Sakaguchi, Chris W. Rella, Edward Wahl

Proceedings Volume 6349, Photomask Technology 2006; 63492R (2006) https://doi.org/10.1117/12.692934
Event: SPIE Photomask Technology, 2006, Monterey, California, United States

Abstract

In the semiconductor industry, control of ammonia at the parts-per-billion concentration level is critical to insure the integrity of the lithography process. Ammonia is emitted into wafer fab air by various semiconductor processes including CVD, wafer cleaning, coater tracks, and CMP, as well as from outdoor air. Exposure to even low parts-per-billion concentrations of ammonia during the photolithography process can lead to yield loss and unscheduled equipment downtime. Picarro, Inc. has developed a field-deployable, real time, ambient gas analyzer capable of continuously monitoring parts-per-trillion levels of ammonia in situ, and in real-time, thereby allowing a user to directly monitor ammonia levels in sensitive photo-lithography equipment.

Citation Download Citation

Eric Crosson, Katsumi Nishimura, Yuhei Sakaguchi, Chris W. Rella, and Edward Wahl "Real-time ultra-sensitive ambient ammonia monitor for advanced lithography", Proc. SPIE 6349, Photomask Technology 2006, 63492R (20 October 2006); https://doi.org/10.1117/12.692934

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