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1 November 2007 Optical response property of photo-heat sensitive microcapsule
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Proceedings Volume 6423, International Conference on Smart Materials and Nanotechnology in Engineering; 642338 (2007)
Event: International Conference on Smart Materials and Nanotechnology in Engineering, 2007, Harbin, China
Microcapsule material can be controlled to perform various functions for its unique characteristics by changing certain environmental conditions, such as mechanical, chemical or electrical factors. In information-recording field, the applications of pressure-sensitive and heat-sensitive microcapsules have matured sufficiently. But limited by the size of thermal or pressure print head, these kinds of microcapsules can not realize the high image resolution printing. Based on microcapsule, as well as photo-responsive and heat-sensitive techniques, the photo-heat sensitive microcapsule can react quickly to very wavelength by photo-curing and can record the optical information of high-resolution. In this paper, a novel photo-heat sensitive microcapsule has been synthesized by interfacial polymerization method. Some factors that affected the size and distribution of microcapsule had been considered, the relationship between particle size distribution and the shearing speed was mainly discussed. In order to eliminate the photographic fog, the microencapsulation of developer was adopted in experiment. Optical response property of the photo-heat sensitive microcapsule was studied. The relationship curve between image density and exposing time was obtained. This new generation high resolution recording material can be used in optically controlled digital image reproduction field.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Xiaowei Li, Nan Zhang, Weidong Lai, Shuxu Sun, and Wenli Wang "Optical response property of photo-heat sensitive microcapsule", Proc. SPIE 6423, International Conference on Smart Materials and Nanotechnology in Engineering, 642338 (1 November 2007);

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