Granularity and penetrability property of microcapsule synthesized with interfacial polymerization technique

Weidong Lai; Xiaowei Li; Nan Zhang; Shuxu Sun

doi:10.1117/12.780138

1 November 2007 Granularity and penetrability property of microcapsule synthesized with interfacial polymerization technique

Weidong Lai, Xiaowei Li, Nan Zhang, Shuxu Sun

Author Affiliations +

Proceedings Volume 6423, International Conference on Smart Materials and Nanotechnology in Engineering; 64234E (2007) https://doi.org/10.1117/12.780138
Event: International Conference on Smart Materials and Nanotechnology in Engineering, 2007, Harbin, China

Abstract

Continuous and semipermeable films or coatings have been receiving a great of fundamental scientific and practical interest, for improving the function-control properties of encapsulated compounds. In this paper, the polyurea film is synthesized with the interface polymerization method. To investigate the penetrability property, color-form function compound is encapsulated. The shape and diameter of the microcapsules are studied and microcapsules with size smaller than 1µm have been prepared, which can act as basic function cell with excellent smart property to response the outside thermal stimuli. From TG results, the polyurea microcapsule has high thermal stability. The penetrability property of the microcapsule system is obtained. Color density against heat-processing time and developing temperature confirms that the penetrability variety is ascribed to thermal condition. The penetrability shows a normally linear trend under given thermal-processing condition, while the penetrability process would achieve to stable state after long penetrating time, though at different initial thermal condition the penetrability velocity is different.

Citation Download Citation

Weidong Lai, Xiaowei Li, Nan Zhang, and Shuxu Sun "Granularity and penetrability property of microcapsule synthesized with interfacial polymerization technique", Proc. SPIE 6423, International Conference on Smart Materials and Nanotechnology in Engineering, 64234E (1 November 2007); https://doi.org/10.1117/12.780138

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