DPSSL for direct dicing and drilling of dielectrics

David Ashkenasi; M. Schwagmeier

doi:10.1117/12.700129

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13 March 2007 DPSSL for direct dicing and drilling of dielectrics

David Ashkenasi, M. Schwagmeier

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Proceedings Volume 6458, Photon Processing in Microelectronics and Photonics VI; 64580F (2007) https://doi.org/10.1117/12.700129
Event: Lasers and Applications in Science and Engineering, 2007, San Jose, California, United States

Abstract

New strategies in laser micro processing of glasses and other optically transparent materials are being developed with increasing interest and intensity using diode pumped solid state laser (DPSSL) systems generating short or ultra-short pulses in the optical spectra at good beam quality. Utilizing non-linear absorption channels, it can be demonstrated that ns green (532 nm) laser light can scribe, dice, full body cut and drill (flat) borofloat and borosilicate glasses at good quality. Outside of the correct choice in laser parameters, an intelligent laser beam management plays an important role in successful micro processing of glass. This application characterizes a very interesting alternative where standard methods demonstrate severe limitations such as diamond dicing, CO2 laser treatment or water jet cutting, especially for certain type of optical materials and/or geometric conditions. Application near processing examples using different DPSSL systems generating ns pulsed light at 532 nm in TEM₀₀ at average powers up to 10 W are presented and discussed in respect to potential applications in display technology, micro electronics and optics.

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David Ashkenasi and M. Schwagmeier "DPSSL for direct dicing and drilling of dielectrics", Proc. SPIE 6458, Photon Processing in Microelectronics and Photonics VI, 64580F (13 March 2007); https://doi.org/10.1117/12.700129

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