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20 March 2007 New high repetition rate, high energy 308 nm excimer laser for material processing
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Abstract
High power excimer lasers are well established as work horses for various kinds of micro material processing. The applications are ranging from drilling holes, trench formation, thin film ablation to the crystallization of amorphous-Si into polycrystalline-Si. All applications use the high photon energy and large pulse power of the excimer technology. The increasing demand for micro scale products has let to the demand for UV lasers which support high throughput production. We report the performance parameters of a newly developed XeCl excimer laser with doubled repetition rate compared to available lasers. The developed laser system delivers up to 900 mJ stabilized pulse energy at 600 Hz repetition rate. The low jitter UV light source operates with excellent energy stability. The outstanding energy stability was reached by using a proprietary solid-state pulser discharge design.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ludolf Herbst, Ingo Klaft, Kai Schmidt, Igor Bragin, and Hans-Stephan Albrecht "New high repetition rate, high energy 308 nm excimer laser for material processing", Proc. SPIE 6459, Laser-based Micro- and Nanopackaging and Assembly, 64590I (20 March 2007); https://doi.org/10.1117/12.717842
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