Initial experience establishing an EUV baseline lithography process for manufacturability assessment

O. R. Wood II; D. Back; R. Brainard; G. Denbeaux; D. Goldfarb; F. Goodwin; J. Hartley; K. Kimmel; C. Koay; B. La Fontaine; J. Mackey; B. Martinick; W. Montgomery; P. Naulleau; U. Okoroanyanwu; K. Petrillo; B. Pierson; M. Tittnich; S. Trogisch; T. Wallow; Y. Wei

doi:10.1117/12.714016

15 March 2007 Initial experience establishing an EUV baseline lithography process for manufacturability assessment

O. R. Wood II, D. Back, R. Brainard, G. Denbeaux, D. Goldfarb, F. Goodwin, J. Hartley, K. Kimmel, C. Koay, B. La Fontaine, J. Mackey, B. Martinick, W. Montgomery, P. Naulleau, U. Okoroanyanwu, K. Petrillo, B. Pierson, M. Tittnich, S. Trogisch, T. Wallow, Y. Wei

Author Affiliations +

Proceedings Volume 6517, Emerging Lithographic Technologies XI; 65170U (2007) https://doi.org/10.1117/12.714016
Event: SPIE Advanced Lithography, 2007, San Jose, California, United States

Abstract

The International Venture for Nanolithography (INVENT) initiative announced in mid 2005, a unique industry-university consortium between the College of Nanoscale Science and Engineering at Albany and a group of leading edge integrated device manufacturers, has launched an extensive R&D program on EUV lithography (EUVL). The overall scope of the INVENT EUVL program, the status of our efforts to establish a baseline lithography process on a full-field EUVL scanner, and our progress in evaluating EUV resist materials, in designing a custom reticle for scanner characterization and in developing an actinic EUV mask imaging microscope, are discussed.

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O. R. Wood II, D. Back, R. Brainard, G. Denbeaux, D. Goldfarb, F. Goodwin, J. Hartley, K. Kimmel, C. Koay, B. La Fontaine, J. Mackey, B. Martinick, W. Montgomery, P. Naulleau, U. Okoroanyanwu, K. Petrillo, B. Pierson, M. Tittnich, S. Trogisch, T. Wallow, and Y. Wei "Initial experience establishing an EUV baseline lithography process for manufacturability assessment", Proc. SPIE 6517, Emerging Lithographic Technologies XI, 65170U (15 March 2007); https://doi.org/10.1117/12.714016

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