Non-ionic photoacid generators for chemically amplified resists: evaluation results on the application-relevant properties

Toshikage Asakura; Hitoshi Yamato; Yuichi Nishimae; Masaki Ohwa

doi:10.1117/12.708399

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2 April 2007 Non-ionic photoacid generators for chemically amplified resists: evaluation results on the application-relevant properties

Toshikage Asakura, Hitoshi Yamato, Yuichi Nishimae, Masaki Ohwa

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Proceedings Volume 6519, Advances in Resist Materials and Processing Technology XXIV; 65192L (2007) https://doi.org/10.1117/12.708399
Event: SPIE Advanced Lithography, 2007, San Jose, California, United States

Abstract

Recently we have developed and reported some novel non-ionic photoacid generators (PAGs) which generate a strong acid (perfluorobutanesulfonic acid) by light irradiation and is applicable to chemically amplified ArF photoresist, such as 2-[2,2,3,3,4,4,5,5-octafluoro-1-(nonafluorobutylsulfonyloxyimino)-pentyl]-fluorene (ONPF), 2- [2,2,3,3,4,4,4-heptafluoro-1-(nonafluorobutylsulfonyloxyimino)-butyl]-fluorene (HNBF) and so on. Here the lithographic property of ONPF in some ArF model formulations was evaluated under 193 nm dry and immersion exposure comparing one of the most typical ionic PAGs, triphenylsulfonium perfluorobutanesulfonate (TPSPB), on lithographic application-relevant properties, e.g. exposure latitude, line edge roughness (LER) and so on, by top-down view SEM observation. 80 nm line and space (L/S) patterning was successfully conducted. Additionally we investigated the striation issue with ONPF when the matrix polymer of resist was changed. It was revealed that ONPF showed better coating property in a copolymer of &ggr;-butyrolactone methacrylate, 2-ethyladamantyl methacrylate and hydroxyladamantyl methacrylate than in a copolymer of &dgr;-methacryloyloxynorbornane butyrolactone in lactone unit.

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Toshikage Asakura, Hitoshi Yamato, Yuichi Nishimae, and Masaki Ohwa "Non-ionic photoacid generators for chemically amplified resists: evaluation results on the application-relevant properties", Proc. SPIE 6519, Advances in Resist Materials and Processing Technology XXIV, 65192L (2 April 2007); https://doi.org/10.1117/12.708399

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