Translator Disclaimer
2 April 2007 Rework/stripping of multilayer materials for FEOL and BEOL integration using single wafer tool techniques
Author Affiliations +
As feature sizes continue to the 45nm and 32nm nodes, significant challenges will continue to arise in both front-end-of-line (FEOL) and back-end-of-line (BEOL) applications. The reduced thickness, as well as the reduced etch resistance, of the photoresist (PR) makes it nearly impossible to use the PR as both an imaging and a pattern transfer layer. This etch challenge has led device manufacturers and vendors to explore the use of multi-layer (trilayer) stacks. Multilayer stacks are typically comprised of a thick via-filling organic layer that will provide adequate etch resistance while etching into low-k and ultra-low-k dielectrics. A silicon-containing layer is then applied on top of the via-filling layer, which will provide improved imaging, as well as etch resistance for the organic layer. The PR is then applied on top to complete the multilayer stack. While many challenges have presented themselves in multilayer stacks, new challenges such as rework and cleaning have arisen. As low-k and ultra-low-k dielectrics become more prevalent, traditional oxygen ashing processes for the removal of PR and anti-reflective coatings can cause damage to the dielectric layer due to the chemical and physical structures of the materials involved. While some processes have been developed to replace damaged dielectric material during ashing and etching through silyation, alternate processes are being developed where entirely wet stripping processes can remove multilayer stacks. One advantage of an entirely wet removal process is that it can prevent damage caused by ashing or etching, and the wet stripper is developed so it does not attack the dielectric films. While an entirely wet removal process has potential advantages, it still must be proven that these processes can remove residues that are left after etch processes, sufficient removal of particles are obtained, and any material loss of the dielectric layer meets the requirements of the customer and the International Technology Roadmap for Semiconductors (ITRS). Other challenges are presenting themselves, as many customers would like to move from batch-type wet rework or cleaning processes to single wafer tool processes. It is the intent of this paper to not only identify new wet cleaning materials that can be used to remove multilayer materials by means of an entirely wet process, but also to find single wafer tool processes that produce fewer particles (defects) and cause no dielectric material loss.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Stephen Turner "Rework/stripping of multilayer materials for FEOL and BEOL integration using single wafer tool techniques", Proc. SPIE 6519, Advances in Resist Materials and Processing Technology XXIV, 65192Q (2 April 2007);

Back to Top