SOFT: smooth OPC fixing technique for ECO process

Hongbo Zhang; Zheng Shi

doi:10.1117/12.712878

21 March 2007 SOFT: smooth OPC fixing technique for ECO process

Hongbo Zhang, Zheng Shi

Proceedings Volume 6521, Design for Manufacturability through Design-Process Integration; 65211H (2007) https://doi.org/10.1117/12.712878
Event: SPIE Advanced Lithography, 2007, San Jose, California, United States

Abstract

SOFT (Smooth OPC Fixing Technique) is a new OPC flow developed from the basic OPC framework. It provides a new method to reduce the computation cost and complexities of ECO-OPC (Engineering Change Order - Optical Proximity Correction). In this paper, we introduce polygon comparison to extract the necessary but possibly lost fragmentation and offset information of previous post-OPC layout. By reusing these data, we can start the modification on each segment from a more accurate initial offset. In addition, the fragmentation method in the boundary of the patch in the previous OPC process is therefore available for engineers to stitch the regional ECO-OPC result back to the whole post-OPC layout seamlessly. For the ripple effect in the OPC, by comparing each segment's movement in each loop, we much free the fixing speed from the limitation of patch size. We handle layout remodification, especially in three basic kinds of ECO-OPC processes, while maintaining other design closure. Our experimental results show that, by utilizing the previous post-OPC layout, full-chip ECO-OPC can realize an over 5X acceleration and the regional ECO-OPC result can also be stitched back into the whole layout seamlessly with the ripple effect of the lithography interaction.

Citation Download Citation

Hongbo Zhang and Zheng Shi "SOFT: smooth OPC fixing technique for ECO process", Proc. SPIE 6521, Design for Manufacturability through Design-Process Integration, 65211H (21 March 2007); https://doi.org/10.1117/12.712878

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