A novel model building flow for the simulation of proximity effects of mask processes

Jonathan Mas; Engelbert Mittermeier

doi:10.1117/12.736549

3 May 2007 A novel model building flow for the simulation of proximity effects of mask processes

Jonathan Mas, Engelbert Mittermeier

Proceedings Volume 6533, 23rd European Mask and Lithography Conference; 65331N (2007) https://doi.org/10.1117/12.736549
Event: European Mask and Lithography Conference2007, 2007, Grenoble, France

Abstract

Linearity- and proximity effects are present on actual masks even if manufactured with current state-of-the-art mask processes. Currently the mask writers rectify the difference on the target critical dimension generated by these effects by changing the dose in function of the density of the pattern. However, the accuracy of this compensation is limited resulting in a deviation dependent of the critical dimensions (CD) from the design. The consequences of these mask imperfections on the photolithographic results on the wafer get increasingly into focus with each shrink in the semiconductor technology. In this paper we will present a procedure for building mask proximity simulation models. In a first part this new flow will be introduced, then one application on the Electron beam lithography modelling is exposed.

Citation Download Citation

Jonathan Mas and Engelbert Mittermeier "A novel model building flow for the simulation of proximity effects of mask processes", Proc. SPIE 6533, 23rd European Mask and Lithography Conference, 65331N (3 May 2007); https://doi.org/10.1117/12.736549

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