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10 May 2007 A CTE matched hard solder passively cooled laser diode package combined with nXLT facet passivation enables high power, high reliability operation
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Abstract
A conductively cooled laser diode package design with hard AuSn solder and CTE matched sub mount is presented. We discuss how this platform eliminates the failure mechanisms associated with indium solder. We present the problem of catastrophic optical mirror damage (COMD) and show that nLight's nXLTTM facet passivation technology effectively eliminates facet defect initiated COMD as a failure mechanism for both single emitter and bar format laser diodes. By combining these technologies we have developed a product that has high reliability at high powers, even at increased operation temperatures. We present early results from on-going accelerated life testing of this configuration that suggests an 808nm, 30% fill factor device will have a MTTF of more than 21khrs at 60W CW, 25°C operating conditions and a MTTF of more than 6.4khrs when operated under hard pulsed (1 second on, 1 second off) conditions.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Aaron Hodges, Jun Wang, Mark DeFranza, Xingsheng Liu, Bill Vivian, Curt Johnson, Paul Crump, Paul Leisher, Mark DeVito, Robert Martinsen, and Jacob Bell "A CTE matched hard solder passively cooled laser diode package combined with nXLT facet passivation enables high power, high reliability operation", Proc. SPIE 6552, Laser Source Technology for Defense and Security III, 65521E (10 May 2007); https://doi.org/10.1117/12.730700
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