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15 May 2007 Enhancing productivity and sensitivity in mask production via a fast integrated T+R pattern inspection and STARlight-2 contamination inspection on critical layers
Jean-Paul Sier, Eric Haodong Lu, Kaustuve Bhattacharyya, Swapnajit Chakravarty, Michael Lang, Heiko Schmalfuss, Jan Heumann, Thomas Schulmeyer
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Proceedings Volume 6607, Photomask and Next-Generation Lithography Mask Technology XIV; 66072C (2007) https://doi.org/10.1117/12.728995
Event: Photomask and Next-Generation Lithography Mask Technology XIV, 2007, Yokohama, Japan
Abstract
Transmitted Light (ddT or dbT) pattern inspection and STARlight-2TM (SL2) contamination inspection are widely employed by mask makers in order to detect pattern and contamination defects on photomasks during the mask inspection process. However, such an approach needs a two-pass inspection to detect pattern defects and contamination defects separately. In this paper we introduce the 'Fast Integrated T+R and SL2' capability and investigate the properties of this combination of Transmitted (T) and Reflected (R) light inspection on die areas and STARlight-2TM(SL2) on scribe areas. 'Fast Integrated T+R and SL2' has the capability to reduce a two-pass inspection to a single set-up and single pass inspection resulting in a substantial saving of inspection time. In addition to a throughput enhancement, 'Fast Integrated T+R and SL2' is able to compliment the pattern T inspection by providing additional sensitivity to detect challenging defects. During this study we collect and analyze inspection data on a critical layer provided by the Advanced Mask Technology Center. Compared to the 2-pass individual mode pattern T and contamination SL2 inspections, a single scan 'Fast Integrated T+R and SL2' demonstrates the capability to capture additional real defects, improves reticle inspectability and first time success rate, and results in a significant enhancement in productivity. Based on empirical data collected in this study, the Fast Integrated T+R and SL2 inspection is able to improve inspection throughput approximately 45% at P90.
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Jean-Paul Sier, Eric Haodong Lu, Kaustuve Bhattacharyya, Swapnajit Chakravarty, Michael Lang, Heiko Schmalfuss, Jan Heumann, and Thomas Schulmeyer "Enhancing productivity and sensitivity in mask production via a fast integrated T+R pattern inspection and STARlight-2 contamination inspection on critical layers", Proc. SPIE 6607, Photomask and Next-Generation Lithography Mask Technology XIV, 66072C (15 May 2007); https://doi.org/10.1117/12.728995
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KEYWORDS
Inspection
Defect detection
Contamination
Reticles
Defect inspection
Photomasks
Detection and tracking algorithms
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