Wafer dicing utilizing unique beam shapes

Todd Lizotte; Orest Ohar

doi:10.1117/12.732129

12 September 2007 Wafer dicing utilizing unique beam shapes

Todd Lizotte, Orest Ohar

Proceedings Volume 6663, Laser Beam Shaping VIII; 66630L (2007) https://doi.org/10.1117/12.732129
Event: Photonic Devices + Applications, 2007, San Diego, California, United States

Abstract

Laser dicing of wafers is of keen interest to the semiconductor and LED industry. Devices such as ASICs, Ultra-thin Wafer Scale Packages and LEDS are unique in that they typically are formed from various materials in a multilayered structure. Many of these layers include active device materials, passivation coatings, conductors and dielectric films all deposited on top of a bulk wafer substrate and all potentially having differing ablation thresholds. These composite multi-layered structures require high finesse laser processes to ensure yields, cut quality and low process cost. Such processes have become very complex over the years as new devices have become miniaturized, requiring smaller kerf sizes. Of critical concern is the need to minimize substrate micro-cracking or lift off of upper layers along the dicing streets which directly corresponds to bulk device strength and device operational integrity over its projected lifetime. Laser processes involving the sequential use of single or multiple diode pumped solid state (DPSS) lasers, such as UV DPSS (355nn, 266nm, 532 nm), VIS DPSS (~532 nm) and IR DPSS (1064nm, 1070nm) as well as (UV, VIS, NIR, FIR and Eye Safe Wavelengths) DPFL (Diode Pumped Fiber Lasers) lasers to penetrate various and differing material layers and substrates including Silicon Carbide (SiC), Silicon, GaAs and Sapphire. Development of beam shaping optics with the purpose of permitting two or more differing energy densities within a single focused or imaged beam spot would provide opportunities for pre-processing or pre-scribing of thinner cover layers, while following through with a higher energy density segment to cut through the bulk base substrates. This paper will describe the development of beam shaping optical elements with unique beam shapes that could benefit dicing and patterning of delicate thin film coatings. Various designs will be described, with processing examples using LED wafer materials.

Citation Download Citation

Todd Lizotte and Orest Ohar "Wafer dicing utilizing unique beam shapes", Proc. SPIE 6663, Laser Beam Shaping VIII, 66630L (12 September 2007); https://doi.org/10.1117/12.732129

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