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14 September 2007 High-speed form preserving polishing of precision aspheres
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Abstract
The two major process steps, grinding and polishing, of the classical process chain have to fulfill the following requirements: Grinding: low subsurface damage, no cutter marks and best shape accuracy Polishing: fast removal of subsurface damage by form preserving The goal for the polishing step is a flexible process capable of removing mm3/min by keeping the shape generated by the grinding process or improving the shape in parallel to the required specifications. To be fast a new polishing kinematics is applied. The improvement of the removal rate is in the order of 2-3 compared to a standard asphere polishing processes. The drawback is a huge spatial variation of the removal rate. By application of proper simulation procedures this shortcomings can be overcome, requiring a detailed understanding of the local removal rate. Furthermore an extensive set of analysis tools such as PSD based evaluation of 1 and 2D shape measurements and separation tools for grouping of surface errors are applied. They help to understand and optimize the local polishing action and to define the cut-off wavelength for the final correction step. Results of the simulation, evaluation and experimental results for 3 different kinds of aspheres will be presented to demonstrate the power of described approach.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Rainer Boerret, Andreas Kelm, and Helge Thiess "High-speed form preserving polishing of precision aspheres", Proc. SPIE 6671, Optical Manufacturing and Testing VII, 667113 (14 September 2007); https://doi.org/10.1117/12.733746
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