Paper
27 November 2007 3-D topography measurement by moire stripe
Jianxin Qiu, Liang Tan, Ping Zhong
Author Affiliations +
Proceedings Volume 6723, 3rd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optical Test and Measurement Technology and Equipment; 67232F (2007) https://doi.org/10.1117/12.783304
Event: 3rd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Large Mirrors and Telescopes, 2007, Chengdu, China
Abstract
Using 3-D topography measurement of microelectronics Substrate as a background, the mechanism and method of accurately measured mechanical quantity through Moire stripe is studied. The paper also discusses the acquisition of Moire interference fringe image information, the analysis and process of Moire stripe image and key technological problems of how to reconstruct 3-D surface topography through Moire stripe information. This study provides non contact, high-speed and high-accuracy measurement techniques not only for microelectronics substrate but also for other information products (like shadow mask). It can be foreseen that this method has broad applications and theoretical instructions in engineering area.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jianxin Qiu, Liang Tan, and Ping Zhong "3-D topography measurement by moire stripe", Proc. SPIE 6723, 3rd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optical Test and Measurement Technology and Equipment, 67232F (27 November 2007); https://doi.org/10.1117/12.783304
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KEYWORDS
3D image processing

3D metrology

Microelectronics

3D acquisition

3D image reconstruction

Image processing

Moire patterns

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