Full-chip process window aware OPC capability assessment

Robert Lugg; Matt StJohn; Yunqiang Zhang; Amy Yang; Paul Van Adrichem

doi:10.1117/12.746839

30 October 2007 Full-chip process window aware OPC capability assessment

Robert Lugg, Matt StJohn, Yunqiang Zhang, Amy Yang, Paul Van Adrichem

Proceedings Volume 6730, Photomask Technology 2007; 67302U (2007) https://doi.org/10.1117/12.746839
Event: SPIE Photomask Technology, 2007, Monterey, California, United States

Abstract

In the past technology generations, Optical Proximity Correction (OPC) has been applied using a model capturing the Optical proximity effects in a single focal plane. In the newer generations, this method is more and more difficult to maintain because of very small process windows in specific situations. These specific situations include 1D configurations (e.g. isolated small lines) but increasingly complex 2D configurations. In the more advanced technology nodes 2D configuration are starting to play a much bigger role. Process windows need to be preserved in all cases, and so this brings about another challenge for the OPC flow. The more traditional OPC approaches may result in un-acceptable small process window in such cases, whereas well characterized Process Window aware OPC (PW-OPC) can provide better results, with much less engineering interventions. In this paper the method of Process Window aware OPC is applied on special designed test structures and on a larger scale (full chip). Verifications and assessments are demonstrated and compared with alternatives. In the past OPC engineers have been pushing for more and more design constraints in order to allow the OPC flow to be successful. The PW-OPC approach is more adaptive compared with traditional single focal plane OPC, and can still converge to an acceptable solution in complicated (unforeseen) layout configurations, without the need to introduce complicated design constraints.

Citation Download Citation

Robert Lugg, Matt StJohn, Yunqiang Zhang, Amy Yang, and Paul Van Adrichem "Full-chip process window aware OPC capability assessment", Proc. SPIE 6730, Photomask Technology 2007, 67302U (30 October 2007); https://doi.org/10.1117/12.746839

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members: $17.00

Non-members: $21.00 ADD TO CART

PROCEEDINGS
11 PAGES

DOWNLOAD PAPER SAVE TO MY LIBRARY

GET CITATION

RIGHTS & PERMISSIONS

Get copyright permission Get copyright permission on Copyright Marketplace

KEYWORDS

Optical proximity correction

Critical dimension metrology

Metals

Diffractive optical elements

Atrial fibrillation

Image segmentation

Nano opto mechanical systems

Show All Keywords

Keywords/Phrases

Search In:

Publication Years