Paper
9 January 2008 The method of performance advancement using modified neural network for test algorithm of semiconductor packages
Chang-Hyun Kim, Hong-Yeon Yu, Sung-Hoon Hong
Author Affiliations +
Proceedings Volume 6794, ICMIT 2007: Mechatronics, MEMS, and Smart Materials; 679455 (2008) https://doi.org/10.1117/12.784191
Event: ICMIT 2007: Mechatronics, MEMS, and Smart Materials, 2007, Gifu, Japan
Abstract
The classification of defects in semiconductor packages was performed by the pattern recognition technology with modified neural network is based on image processing. The pattern recognition algorithm is composed of image processing and modified backpropagation neural network. Image processing is preprocessing method for dimensionality reduction that is input data of backpropagation neural network. And image processing is simply made of image equalization and binary image conversion and edge detection for reducing operation time. And most of algorithm of backpropagation neural network is generally used uniform train weight, but the algorithm in this research is applied to variously subdivided train weights of backpropagation neural network based on types of semiconductor packages according to kinds of defects. Through above processes, we obtained advanced result of pattern recognition about defects in semiconductor packages.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Chang-Hyun Kim, Hong-Yeon Yu, and Sung-Hoon Hong "The method of performance advancement using modified neural network for test algorithm of semiconductor packages", Proc. SPIE 6794, ICMIT 2007: Mechatronics, MEMS, and Smart Materials, 679455 (9 January 2008); https://doi.org/10.1117/12.784191
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KEYWORDS
Image processing

Neural networks

Detection and tracking algorithms

Semiconductors

Evolutionary algorithms

Binary data

Pattern recognition

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