Effect of dispersing nano-materials into structural adhesive on the electrical and mechanical properties

Anil Chinnabhandar; H. N. Narasimha Murthy; M. Krishna

doi:10.1117/12.784812

27 December 2007 Effect of dispersing nano-materials into structural adhesive on the electrical and mechanical properties

Anil Chinnabhandar, H. N. Narasimha Murthy, M. Krishna

Author Affiliations +

Proceedings Volume 6799, BioMEMS and Nanotechnology III; 67991H (2007) https://doi.org/10.1117/12.784812
Event: SPIE Microelectronics, MEMS, and Nanotechnology, 2007, Canberra, ACT, Australia

Abstract

This paper highlights a systematic investigation (related to percentage addition of solvents) of finding the appropriate solvent to reduce the viscosity of the structural grade of resin (AV138M) within castable range to effectively disperse the nano-fillers (Carbon Nano Powder - CNP and Multi Walled Carbon Nano Tubes - MWCNT). AV138M + HY998/CNP and AV138 + HY998/MWCNT were cast within-process degassing using a vacuum pump of capacity 4 torr. High energy sonic waves (27000 kHz) were used for dispersion. Morphological studies were undertaken to analyze the uniformity in dispersion of nano-fillers. The cured specimens were subjected to: Resistivity measurements using a Resistivity Meter, Glass Transition Temperature (T_g) using a Differential Scanning Calorimetry (DSC) and Tensile properties using UTM. The properties have been determined for the nanocomposites with different wt % of the fillers. It has been found that for 0.6 wt % of filler (CNP / MWCNT), there is an increase in UTS of 10 times for MWCNT compared to CNP; for 1.0 wt % of the fillers, the T_g improved by 10 ºC for MWCNT and by 4 ºC for CNP when compared with neat resin. Both CNP and MWCNT showed drop in electrical resistivity of the neat resin; a drop to the extent of 10³ has been achieved with 1 wt % MWCNT and the same was 2 wt % in case of CNP.

Citation Download Citation

Anil Chinnabhandar, H. N. Narasimha Murthy, and M. Krishna "Effect of dispersing nano-materials into structural adhesive on the electrical and mechanical properties", Proc. SPIE 6799, BioMEMS and Nanotechnology III, 67991H (27 December 2007); https://doi.org/10.1117/12.784812

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