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29 November 2007 An active interconnecting mechanism for free-space optic applications
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Abstract
In this paper, a new method for interconnecting free-space micro-optoelectromechanical system (MOEMS) devices is developed. The heterogeneous design and assembly concept is demonstrated by a pair of V-shape actuators and related assembly mechanism, fabricated on a silicon-on-insulator (SOI) wafer. A two-channel free-space DWDM filter has been assembled and characterized. The results show low insertion losses. The device architecture allows hybrid optical system integration on a single platform. The assembled optical devices can be made of different materials, on different substrates and/or with incompatible fabrication techniques. The integration platform provides potentials for realizing a micro optical bench with equivalent optical performance that currently require bulk optics setups.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ping Zhang, Kevin Le, Lun-Chen Hsu, Praveen Pandojirao-Sunkojirao, Smitha Malalur-Nagaraja-Rao, and J.-C. Chiao "An active interconnecting mechanism for free-space optic applications", Proc. SPIE 6836, MEMS/MOEMS Technologies and Applications III, 683604 (29 November 2007); https://doi.org/10.1117/12.757799
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