Composite-copper, low-thermal-resistance heat sinks for laser-diode bars, mini-bars and single-emitter devices

Robert Miller; Daming Liu; Michael Horsinka; Touyen Nguyen; Kiran Kuppuswamy; Terrance Towe; Hanxuan Li; Myra Berube; James Harrison; Edmund Wolak

doi:10.1117/12.764087

13 February 2008 Composite-copper, low-thermal-resistance heat sinks for laser-diode bars, mini-bars and single-emitter devices

Robert Miller, Daming Liu, Michael Horsinka, Touyen Nguyen, Kiran Kuppuswamy, Terrance Towe, Hanxuan Li, Myra Berube, James Harrison, Edmund Wolak

Author Affiliations +

Proceedings Volume 6876, High-Power Diode Laser Technology and Applications VI; 687607 (2008) https://doi.org/10.1117/12.764087
Event: Lasers and Applications in Science and Engineering, 2008, San Jose, California, United States

Abstract

Here we present characteristic performance of laser-diode devices employing a novel CTE-matched heatsink technology (where CTE is Coefficient of Thermal Expansion). Design variants of the composite-copper platforms include form-fit-compatible versions of production CS (for standard 1-cm-wide bars) and CT (for single-emitter devices and mini-bars) assemblies. Both employ single-step AuSn bonding and offer superior thermal performance to that of current production standards. These attributes are critical to reliability at high powers in both CW and hard-pulse (e.g., 1sec on/1sec off) operation. The superior thermal performance of the composite-copper CS device has been verified in CW testing of bars where 85W is typically obtained at 95A (compared to 76W from production-standard, indium-bonded, solid-copper CS devices). This result is especially significant as alternative CTE-matched bar platforms (e.g., those employing a sub-mount bonded to a solid copper heatsink) typically compromise the effective thermal resistance in order to achieve the CTE match (and often require two-step bonding). The close CTE match of the composite-copper CS results in relatively narrow, single-peaked spectra. Initial step stress tests of eight devices in hard-pulse operation up to 80A has been completed with no observed failures. Six of these devices have subsequently been operated in hard-pulse mode at 55A for >4000 with no failures. The CT variant of the composite-copper heatsink is predicted to offer a reduction in thermal resistance of nearly 30% for a 5-emitter mini-bar (500-μm pitch). In first-article testing, the maximum achievable CW power increased from 20W (standard CuW CT) to 24W (composite-copper CT). As with the CS devices, the composite-copper CT assemblies exhibited characteristically narrower spectral profiles.

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Robert Miller, Daming Liu, Michael Horsinka, Touyen Nguyen, Kiran Kuppuswamy, Terrance Towe, Hanxuan Li, Myra Berube, James Harrison, and Edmund Wolak "Composite-copper, low-thermal-resistance heat sinks for laser-diode bars, mini-bars and single-emitter devices", Proc. SPIE 6876, High-Power Diode Laser Technology and Applications VI, 687607 (13 February 2008); https://doi.org/10.1117/12.764087

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