18 February 2008Qualification testing of engineering camera and platinum resistance thermometer (PRT) sensors for Mars Science Laboratory (MSL) project under extreme temperatures to assess reliability and to enhance mission assurance
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Package Qualification and Verification (PQV) of advanced electronic packaging and
interconnect technologies and various other types of qualification hardware for the Mars
Exploration Rover/Mars Science Laboratory flight projects has been performed to enhance the
mission assurance. The qualification of hardware (Engineering Camera and Platinum Resistance
Thermometer, PRT) under extreme cold temperatures has been performed with reference to
various project requirements. The flight- like packages, sensors, and subassemblies have been
selected for the study to survive three times (3×) the total number of expected temperature cycles
resulting from all environmental and operational exposures occurring over the life of the flight
hardware including all relevant manufacturing, ground operations and mission phases.
Qualification has been performed by subjecting above flight-like qual hardware to the
environmental temperature extremes and assessing any structural failures or degradation in
electrical performance due to either overstress or thermal cycle fatigue. Experiments of flight
like hardware qualification test results have been described in this paper.
Rajeshuni Ramesham,Justin N. Maki, andGordon C. Cucullu
"Qualification testing of engineering camera and platinum resistance thermometer (PRT) sensors for Mars Science Laboratory (MSL) project under extreme temperatures to assess reliability and to enhance mission assurance", Proc. SPIE 6884, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII, 68840E (18 February 2008); https://doi.org/10.1117/12.765274
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Rajeshuni Ramesham, Justin N. Maki, Gordon C. Cucullu, "Qualification testing of engineering camera and platinum resistance thermometer (PRT) sensors for Mars Science Laboratory (MSL) project under extreme temperatures to assess reliability and to enhance mission assurance," Proc. SPIE 6884, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII, 68840E (18 February 2008); https://doi.org/10.1117/12.765274