Review: fine embossing of novel glasses for photonic integrated circuits

A. B. Seddon; D. Furniss; W. J. Pan; P. Sewell; A. Loni; Y. Zhang; T. M. Benson

doi:10.1117/12.760888

22 February 2008 Review: fine embossing of novel glasses for photonic integrated circuits

A. B. Seddon, D. Furniss, W. J. Pan, P. Sewell, A. Loni, Y. Zhang, T. M. Benson

Proceedings Volume 6890, Optical Components and Materials V; 689007 (2008) https://doi.org/10.1117/12.760888
Event: Integrated Optoelectronic Devices 2008, 2008, San Jose, California, United States

Abstract

Hot embossing of novel inorganic-compound glasses is a new fabrication technology for guided wave devices and circuitry. A patterned mould is pressed into the glass above its glass transition temperature (T_g) and replicated; cooling below T_g freezes-in the required pattern. The state-of-the-art is reviewed. Better than 0.1 μm -scale replication is shown for chalcogenide glasses and fabrication of a hot embossed monomode waveguide demonstrated.

Citation Download Citation

A. B. Seddon, D. Furniss, W. J. Pan, P. Sewell, A. Loni, Y. Zhang, and T. M. Benson "Review: fine embossing of novel glasses for photonic integrated circuits", Proc. SPIE 6890, Optical Components and Materials V, 689007 (22 February 2008); https://doi.org/10.1117/12.760888

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