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7 March 2008 Comparison of bandwidth limits for on-card electrical and optical interconnects for 100 Gb/s and beyond
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Abstract
Aggregate chip bandwidths in server and high performance computing have exceeding Tb/s, and if present trends are to continue would lead to doubling the number of signal pins in each generation. For high bandwidth switch and server applications, bandwidth requirements could exceed the package pin limit as early as 2012. We defined metrics to compare the performance of electrical and optical interconnects, which includes bandwidth density (Gb/s/mm2/port), media bandwidth*distance product (GHz*m), power consumption (mW/Gb/s/Port), and technology comparison metric (Gb/s/mm2/port * GHz*m/mW/Port). We will show that optical interconnects offer a performance metric improvement factor of greater than 25 over electrical interconnects.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Petar Pepeljugoski, Mark Ritter, Jeffrey A. Kash, Fuad Doany, Clint Schow, Young Kwark, Lei Shan, Dong Kam, Xiaoxiong Gu, and Christian Baks "Comparison of bandwidth limits for on-card electrical and optical interconnects for 100 Gb/s and beyond", Proc. SPIE 6897, Optoelectronic Integrated Circuits X, 68970I (7 March 2008); https://doi.org/10.1117/12.766835
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