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8 February 2008 Assembly of optical MUX/DEMUX on silicon optical bench with high placement accuracies
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Abstract
An optical sub-assembly of MUX/DEMUX where optical devices are hybrid-integrated on a silicon optical bench (SiOB) using a low cost passive alignment method was reported. A tight tolerance of positional and tilting angular accuracy is required for optical devices attachment in order to maximize the coupling efficiency. The critical positioning transverse to the optical axis merely depends on the symmetry, and accuracy of the position and shape of trenches. Any inaccuracy primarily affects the non-critical positioning, i.e., z-axis & θz, in the direction along the optical axis; misalignment accumulated and causes undesired insertion loss. All the piece parts, i.e., mirror, thin-film filters (TFFs), ball lens, SiOB etc., have a defined tolerance in their dimensions and surfaces which increases the challenge in achieving high placement accuracy along the optical axis. The effects from these inherent inaccuracies of the position and shape of trenches and piece parts could be minimized by improve the bottom flatness, and proper procedure selection. Misalignment at each axis, e.g. x-, y-, z-, θx, θy & θz was characterized and its effect to the coupling efficiency was discussed.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Chee Wei Tan, Teck Guan Lim, Jing Li, Geri Endrio Tangdiongga, Yi Yoon Chai, Seiji Maruo, Pamidighantam V. Ramana, Seung Wook Yoon, and John H. Lau "Assembly of optical MUX/DEMUX on silicon optical bench with high placement accuracies", Proc. SPIE 6899, Photonics Packaging, Integration, and Interconnects VIII, 68990N (8 February 2008); https://doi.org/10.1117/12.764242
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