Interfacial adhesion studies for step and flash imprint lithography

Michael W. Lin; Daniel J. Hellebusch; Kai Wu; Eui Kyoon Kim; Kuan Lu; Li Tao; Kenneth M. Liechti; John G. Ekerdt; Paul S. Ho; Walter Hu; C. Grant Willson

doi:10.1117/12.772797

20 March 2008 Interfacial adhesion studies for step and flash imprint lithography

Michael W. Lin, Daniel J. Hellebusch, Kai Wu, Eui Kyoon Kim, Kuan Lu, Li Tao, Kenneth M. Liechti, John G. Ekerdt, Paul S. Ho, Walter Hu, C. Grant Willson

Author Affiliations +

Proceedings Volume 6921, Emerging Lithographic Technologies XII; 69210E (2008) https://doi.org/10.1117/12.772797
Event: SPIE Advanced Lithography, 2008, San Jose, California, United States

Abstract

The step and flash imprint lithography (SFIL) process requires the clean separation of a quartz template from a polymer imprint, and the force required to create this separation must be minimized to prevent the generation of defects. According to fracture mechanics principles, decreasing both the imprint polymer modulus and the interfacial fracture energy are beneficial for reducing the separation force. Adjusting the crosslinker concentration in the imprint formulation decreases the modulus but does not significantly impact the facture energy. On the other hand, fluorinated surfactant additives to the imprint fluid lower the modulus of the imprint polymer and decrease the fracture energy. The fracture energy is further decreased by using a nonreactive, liquid surfactant versus a surfactant that reacts with the polymer matrix. Angle-resolved X-ray photoelectron spectroscopy (XPS) results indicate that surfactant migration is more effective with a fluorinated surface treatment compared to an untreated quartz surface. This result shows that the use of fluorinated surfactants must be accompanied by a surface treatment that produces a similar energy or polarity to induce migration and lower the adhesive strength.

Citation Download Citation

Michael W. Lin, Daniel J. Hellebusch, Kai Wu, Eui Kyoon Kim, Kuan Lu, Li Tao, Kenneth M. Liechti, John G. Ekerdt, Paul S. Ho, Walter Hu, and C. Grant Willson "Interfacial adhesion studies for step and flash imprint lithography", Proc. SPIE 6921, Emerging Lithographic Technologies XII, 69210E (20 March 2008); https://doi.org/10.1117/12.772797

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