Paper
20 March 2008 Aberration budget in extreme ultraviolet lithography
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Abstract
It seems that the actual EUV lithography tools will have aberrations around ten times larger than those of the latest ArF lithography tools in wavelength normalized rms. We calculated the influence of aberrations on the size error and pattern shift error using Zernike sensitivity analysis. Mask-induced aberration restricts the specification of aberration. Without periodic additional pattern, the aberration to form 22 nm dual-gate patterns was below 8 mλ rms. Arranging the periodic additional pattern relaxed the aberration tolerance. With periodic additional pattern, the aberration to form 22 nm patterns was below 37 mλ rms. It is important to make pattern periodicity for the relaxation of the aberration specification.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yumi Nakajima, Takashi Sato, Ryoichi Inanami, Tetsuro Nakasugi, and Tatsuhiko Higashiki "Aberration budget in extreme ultraviolet lithography", Proc. SPIE 6921, Emerging Lithographic Technologies XII, 69211A (20 March 2008); https://doi.org/10.1117/12.771602
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Cited by 12 scholarly publications.
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KEYWORDS
Tolerancing

Diffraction

Extreme ultraviolet lithography

Error analysis

Lithography

Phase shifts

Polarization

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