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16 April 2008 Overlay control using scatterometry based metrology (SCOM) in production environment
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Abstract
The newly emerging lithographic technologies related to the 32nm node and below will require a step function in the overlay metrology performance, due to the dramatic shrinking of the error budgets. In this work, we present results of an emerging alternative technology for overlay metrology - Differential signal scatterometry overlay (SCOTM). The technique is based on spectroscopic analysis of polarized light, reflected from a "grating-on-grating" target. Based on theoretical analysis and initial data, this technology, as well as broad band bright field overlay, is a candidate technology that will allow achieving the requirements of the 32nm node and beyond it. We investigate the capability of SCOLTM to control overlay in a production environment, on complex stacks and process, in the context of advanced DRAM and Flash technologies. We evaluate several metrology mark designs and the effect on the metrology performance, in view of the tight TMU requirements of the 32nm node. The results - achieved on the KLA-Tencor's Archer tool, equipped with both broad band bright field AIMTM and scatterometry SCOLTM sensors - indicate the capability of the SCOLTM technology to satisfy the advanced nodes requirements.
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Berta Dinu, Stefan Fuchs, Uwe Kramer, Michael Kubis, Anat Marchelli, Alessandra Navarra, Christian Sparka, and Amir Widmann "Overlay control using scatterometry based metrology (SCOM) in production environment", Proc. SPIE 6922, Metrology, Inspection, and Process Control for Microlithography XXII, 69222S (16 April 2008); https://doi.org/10.1117/12.771581
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