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The RoHS and WEEE regulation forced the large investigations for environmental friendly materials in electronic. The
Lead and cadmium which was the significant component of resistors and conductors used in thick-film technology have
to be replaced. Quick and precise measurement techniques need to be elaborated to maintain consumer's demand.
Usually the test samples with the conductive and resistive layers were used for electrical parameters measurements. The
layer thickness measurements and mean value of resistance allowed calculating the sheet resistance. Such a method of
measurement have very serious disadvantage. The calculated mean value can be significantly affected by resistors
terminations, especially if silver conductor is used, which is known as an easily migrating material. The solution was
known and involved preparing and printing samples with the reference terminations. Silver platinum and silver
palladium conductors are less susceptible to migration, therefore they were used in previous investigations. The
reference terminations improves the precision of calculating sheet resistance, however they enlarges the number of
measurements and its influence could still be significant. The authors proposed completely new method of sheet
resistance calculation. Such a calculated value called True Sheet Resistance do not depend on the phenomena taking
place at the termination, The second evaluated value called Offset indicates the influence of the terminations on
measured resistance, and also termination quality. Its value is correlated with the diffusion rate at the interface between
conductive film and resistive film at the termination. The usability of this method was proven by performing multiple
firing test. One kind of resistive layer was printed on different kinds of conductive layers. The samples were fired
sequently and measured. Then the old method of resistor properties evaluation was compared to the new one.
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