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27 August 2008 Optoelectronic printed circuit board: 3D structures written by two-photon absorption
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The integration of optical interconnects in printed circuit boards (PCB) is a rapidly growing field due to a continuously increasing demand for high data rates, along with a progressive miniaturization of devices and components. For high-speed data transfer, materials and integration concepts are searched for which enable high-speed short-range connections, accounting also for miniaturization, and costs. Many concepts are discussed so far for the integration of optics in PCB: the use of optical fibers, or the generation of waveguides by UV lithography, embossing, or direct laser writing. Most of the concepts require many different materials and process steps. In addition, they also need highly-sophisticated assembly steps in order to couple the optoelectronic elements to the optical waveguides. An innovative approach is presented which only makes use of only one individual inorganic-organic hybrid polymer material to fabricate optical waveguides by two-photon absorption (TPA) processes. Particularly, the waveguides can be directly integrated on pre-configured PCB by in situ positioning the optical waveguides with respect to the mounted optoelectronic components by the TPA process. Thus, no complex packaging or assembly is necessary, and the number of process steps is significantly reduced, where the process fits ideally into the PCB fabrication process. The material properties, the TPA processing of waveguides, and the integration concept will be discussed. Recent experiments employing vertical-cavity surface-emitting lasers demonstrated data rates exceeding 6 Gbit/s.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
R. Houbertz, V. Satzinger, V. Schmid, W. Leeb, and G. Langer "Optoelectronic printed circuit board: 3D structures written by two-photon absorption", Proc. SPIE 7053, Organic 3D Photonics Materials and Devices II, 70530B (27 August 2008);

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