Improving contact and via process latitude through selective upsizing

C. Yuan; G. Abeln; B. Anthony; G. Chen; S. Robertson; P. Walker

doi:10.1117/12.801187

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17 October 2008 Improving contact and via process latitude through selective upsizing

C. Yuan, G. Abeln, B. Anthony, G. Chen, S. Robertson, P. Walker

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Proceedings Volume 7122, Photomask Technology 2008; 712223 (2008) https://doi.org/10.1117/12.801187
Event: SPIE Photomask Technology, 2008, Monterey, California, United States

Abstract

This paper describes a simple technique to improve the process latitude for contact and via printing. The technique applies a selective upsizing algorithm to the mask data during the mask preparation step. For each contact or via, the algorithm looks for available spaces by checking relevant layers near it. When spaces are available, selective edges of a contact or via will be sized to improve the process latitude. This paper describes algorithms used to implement this technique. Multiple designs of various design styles are used to demonstrate the effectiveness of the algorithms. The implications on mask preparation, mask making and wafer processing are also discussed.

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C. Yuan, G. Abeln, B. Anthony, G. Chen, S. Robertson, and P. Walker "Improving contact and via process latitude through selective upsizing", Proc. SPIE 7122, Photomask Technology 2008, 712223 (17 October 2008); https://doi.org/10.1117/12.801187

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