World wide matching of registration metrology tools of various generations

F. Laske; A. Pudnos; L. Mackey; P. Tran; M. Higuchi; C. Enkrich; K.-D. Roeth; K.-H. Schmidt; D. Adam; J. Bender

doi:10.1117/12.802941

17 October 2008 World wide matching of registration metrology tools of various generations

F. Laske, A. Pudnos, L. Mackey, P. Tran, M. Higuchi, C. Enkrich, K.-D. Roeth, K.-H. Schmidt, D. Adam, J. Bender

Author Affiliations +

Proceedings Volume 7122, Photomask Technology 2008; 712230 (2008) https://doi.org/10.1117/12.802941
Event: SPIE Photomask Technology, 2008, Monterey, California, United States

Abstract

Turn around time/cycle time is a key success criterion in the semiconductor photomask business. Therefore, global mask suppliers typically allocate work loads based on fab capability and utilization capacity. From a logistical point of view, the manufacturing location of a photomask should be transparent to the customer (mask user). Matching capability of production equipment and especially metrology tools is considered a key enabler to guarantee cross site manufacturing flexibility. Toppan, with manufacturing sites in eight countries worldwide, has an on-going program to match the registration metrology systems of all its production sites. This allows for manufacturing flexibility and risk mitigation.In cooperation with Vistec Semiconductor Systems, Toppan has recently completed a program to match the Vistec LMS IPRO systems at all production sites worldwide. Vistec has developed a new software feature which allows for significantly improved matching of LMS IPRO(x) registration metrology tools of various generations. We will report on the results of the global matching campaign of several of the leading Toppan sites.

Citation Download Citation

F. Laske, A. Pudnos, L. Mackey, P. Tran, M. Higuchi, C. Enkrich, K.-D. Roeth, K.-H. Schmidt, D. Adam, and J. Bender "World wide matching of registration metrology tools of various generations", Proc. SPIE 7122, Photomask Technology 2008, 712230 (17 October 2008); https://doi.org/10.1117/12.802941

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