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12 November 2008 Hybrid integration for advanced photonic devices
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Proceedings Volume 7135, Optoelectronic Materials and Devices III; 713502 (2008) https://doi.org/10.1117/12.803089
Event: Asia-Pacific Optical Communications, 2008, Hangzhou, China
Abstract
Hybrid photonic integration with passive assembly techniques allows compact optical modules to be realised with high optical performance and low packaging cost. Recent advances in integrating semiconductor optical amplifiers into practical all-optical signal processing modules is described, with applications from optical memory to sophisticated burst-mode optical regenerators.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Alistair Poustie "Hybrid integration for advanced photonic devices", Proc. SPIE 7135, Optoelectronic Materials and Devices III, 713502 (12 November 2008); https://doi.org/10.1117/12.803089
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