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18 November 2008 Investigation of UV photocurable microcapsule inner crosslink extent
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Proceedings Volume 7135, Optoelectronic Materials and Devices III; 71353Q (2008) https://doi.org/10.1117/12.803325
Event: Asia-Pacific Optical Communications, 2008, Hangzhou, China
Abstract
UV photocuring technology has encountered increased applications in recent years, which finds a variety of applications on protective coating of the optical-fiber, ink and optical recording materials. Combined with techniques of photohardenable, microcapsule, heat-sensitive and interface-polymerization method, a novel photoheat sensitive recording material of non-silver salt is explored in this thesis. Microcapsules are particulate substance with a core and shell structure, where photopolymerizable composition, monofunctional/polyfunctional diluents, photopolymerization initiator, photosensitivity enhancing agent and dye precursor are encapsulated as the internal phase. In this paper introduced the characteristics and curing mechanism of photo-sensitive microcapsule materials. The photocuring process may be a complex-function with photopolymerizable compound and photopolymerization initiator. For the sake of high photocuring speed and degree, optimal photo-sensitive materials were selected. In order to match with the light source excitation wavelength and absorb more wider ultraviolet band, combined type of photo-polymerization initiators were employed. With the kinds and dosage of photopolymerization initiator changing, the photocuring speed and quality can be ameliorated. Through studying the UV-visible absorption spectrum and infra-red spectrum of the material , the optical response property of the inner compound can be obtained.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Xiaowei Li, Shuangshuang Meng, Weidong Lai, Haiyang Yu, and Guangsheng Fu "Investigation of UV photocurable microcapsule inner crosslink extent", Proc. SPIE 7135, Optoelectronic Materials and Devices III, 71353Q (18 November 2008); https://doi.org/10.1117/12.803325
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