Laser soldering of enameled wires

S. Böhm; G. Hemken; K. Noack

doi:10.1117/12.808683

24 February 2009 Laser soldering of enameled wires

S. Böhm, G. Hemken, K. Noack

Proceedings Volume 7202, Laser-based Micro- and Nanopackaging and Assembly III; 72020J (2009) https://doi.org/10.1117/12.808683
Event: SPIE LASE: Lasers and Applications in Science and Engineering, 2009, San Jose, California, United States

Abstract

In electrical connections with enameled copper wires, isolation material residue can be found in the solder area when the coating is not stripped. This residue can lead to mechanical and electrical problems. In electronic devices and MEMS, quality requirements increase with rising thermal requirements for electrical contacts made from enameled copper wire. Examples for this exist in the area of automotive electronics, consumer electronics and in the field of machine design. Typical products with electrical connecting which use enameled wires include: micro-phones and speakers (especially for mobile phones), coil forms, small transformers, relays, clock coils, and so on. Due to increasing thermal and electrical requirements, the manufacturer of enameled wires continuously develops new isolating materials for the improvement of isolation classes, thermal resistance, etc. When using current bonding and solder processes, there exist problems for contacting enameled copper wire with these insulation layers. Therefore the Institute of Joining and Welding, Department Micro Joining developed a laser based solder process with which enamels copper wires can enable high quality electrical connections without a preceding stripping process.

Citation Download Citation

S. Böhm, G. Hemken, and K. Noack "Laser soldering of enameled wires", Proc. SPIE 7202, Laser-based Micro- and Nanopackaging and Assembly III, 72020J (24 February 2009); https://doi.org/10.1117/12.808683

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