Optical interconnects for board level applications

R. Dangel; R. Beyeler; N. Meier; T. Lamprecht; F. Horst; D. Jubin; J. Weiss; B. J. Offrein

doi:10.1117/12.811128

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10 February 2009 Optical interconnects for board level applications

R. Dangel, R. Beyeler, N. Meier, T. Lamprecht, F. Horst, D. Jubin, J. Weiss, B. J. Offrein

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Proceedings Volume 7219, Optoelectronic Integrated Circuits XI; 721904 (2009) https://doi.org/10.1117/12.811128
Event: SPIE OPTO: Integrated Optoelectronic Devices, 2009, San Jose, California, United States

Abstract

Optical link technology will play an increasingly important role for board-level interconnects in servers and supercomputers as a means to keep pace with the increasing intra-system bandwidth requirements. Low-cost and high density optical packaging concepts are required. We describe the development of board-level interconnects based on polymer waveguide technology. In this paper, we focus on flexible optical waveguide sheets and the passive alignment of optical connectors.

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R. Dangel, R. Beyeler, N. Meier, T. Lamprecht, F. Horst, D. Jubin, J. Weiss, and B. J. Offrein "Optical interconnects for board level applications", Proc. SPIE 7219, Optoelectronic Integrated Circuits XI, 721904 (10 February 2009); https://doi.org/10.1117/12.811128

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