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27 January 2009 Packaging and characterization of orthogonal transfer array CCDs for the WIYN One Degree Imager
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Proceedings Volume 7249, Sensors, Cameras, and Systems for Industrial/Scientific Applications X; 72490B (2009) https://doi.org/10.1117/12.805950
Event: IS&T/SPIE Electronic Imaging, 2009, San Jose, California, United States
Abstract
The WIYN One Degree Imager (ODI) will provide a one degree field of view for the WIYN 3.5 m telescope located on Kitt Peak near Tucson, Arizona. Its focal plane will consist of an 8x8 grid of Orthogonal Transfer Array (OTA) CCD detectors with nearly one billion pixels. The implementation of these detectors into the focal plane has required the development of several novel packaging and characterization techniques, which are the subject of this paper. We describe a new packaging/hybridization method in which the CCD die are directly bonded to aluminum nitride ceramic substrates which have indium bump on one side and brazed pins on the other. These custom packages allow good thermal conductivity, a flat imaging surface, four side buttability, and in situ testing of the devices during backside processing. We describe these carriers and the backside processing techniques used with them. We have also modified our cold probing system to screen these OTA die at wafer level to select the best candidates for backside processing. We describe these modifications and characterization results from several wafer lots.
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Michael Lesser, David Ouellette, Grzegorz Zareba, George Jacoby, Gary Muller, David Sawyer, Joe Keyes, Richard Bredthauer, and Kasey Boggs "Packaging and characterization of orthogonal transfer array CCDs for the WIYN One Degree Imager", Proc. SPIE 7249, Sensors, Cameras, and Systems for Industrial/Scientific Applications X, 72490B (27 January 2009); https://doi.org/10.1117/12.805950
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