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17 March 2009The SEMATECH Berkeley microfield exposure tool: learning at the 22-nm node and beyond
Patrick P. Naulleau,1 Christopher N. Anderson,2 Lorie-Mae Baclea-an,1 Paul Denham,1 Simi George,1 Kenneth A. Goldberghttps://orcid.org/0000-0001-9984-5780,1 Michael Goldstein,3 Brian Hoef,1 Russ Hudyma,4 Gideon Jones,1 Chawon Koh,3 Bruno La Fontaine,5 Brittany McClinton,1 Ryan H. Miyakawa,1 Warren Montgomery,3 John Roller,1 Thomas Wallow,5 Stefan Wurm3
1Lawrence Berkeley National Lab. (United States) 2Univ. of California, Berkeley (United States) 3SEMATECH, Inc. (United States) 4Hyperion (United States) 5Advanced Micro Devices, Inc. (United States)
Microfield exposure tools (METs) continue to play a dominant role in the development of extreme ultraviolet (EUV)
resists. One of these tools is the SEMATECH Berkeley 0.3-NA MET operating as a SEMATECH resist and mask test
center. Here we present an update summarizing the latest resist test and characterization results. The relatively small
numerical aperture and limited illumination settings expected from 1st generation EUV production tools make resist
resolution a critical issue even at the 32-nm node. In this presentation, sub 22 nm half pitch imaging results of EUV
resists are reported. We also present contact hole printing at the 30-nm level. Although resist development has
progressed relatively well in the areas of resolution and sensitivity, line-edge-roughness (LER) remains a significant
concern. Here we present a summary of recent LER performance results and consider the effect of system-level
contributors to the LER observed from the SEMATECH Berkeley microfield tool.
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Patrick P. Naulleau, Christopher N. Anderson, Lorie-Mae Baclea-an, Paul Denham, Simi George, Kenneth A. Goldberg, Michael Goldstein, Brian Hoef, Russ Hudyma, Gideon Jones, Chawon Koh, Bruno La Fontaine, Brittany McClinton, Ryan H. Miyakawa, Warren Montgomery, John Roller, Thomas Wallow, Stefan Wurm, "The SEMATECH Berkeley microfield exposure tool: learning at the 22-nm node and beyond," Proc. SPIE 7271, Alternative Lithographic Technologies, 72710W (17 March 2009); https://doi.org/10.1117/12.814232