Evaluation of a new photoresist dispense system to detect coating variation

Florent Gapin; Bernard Le-Peutrec; Laurent Stock; Marc Hanotte

doi:10.1117/12.816117

23 March 2009 Evaluation of a new photoresist dispense system to detect coating variation

Florent Gapin, Bernard Le-Peutrec, Laurent Stock, Marc Hanotte

Proceedings Volume 7272, Metrology, Inspection, and Process Control for Microlithography XXIII; 72723L (2009) https://doi.org/10.1117/12.816117
Event: SPIE Advanced Lithography, 2009, San Jose, California, United States

Abstract

A minimal change of dispensed volume will have a severe impact on the film thickness uniformity and in the worst case there might be some lack of resist on the wafer. Therefore it is essential to set-up the photoresist dispense accurately to avoid any dispense variation. In addition, it is important to monitor the dispense conditions real-time to detect problems which may have a direct negative impact on process yield. This paper presents the evaluation of the IntelliGen® Mini dispense system which is manufactured by Entegris, Inc. This new system is able to detect variations like bubbles in the dispense line, changes to the stop suckback valve, and changes in viscosity1. After an explanation of the pump characteristics and the potential root causes of dispense variation and their consequences, the evaluation done in Altis Semiconductor will be presented. The study has been made utilizing different photo-chemicals, including low and mid-range viscosity photo- resists and anti-reflective coatings. The capability of this new product to detect any perturbation of coating will be demonstrated. Then standard tests like coating repeatability, defect density CD uniformity and finally wafer yield inspection will be performed to prove efficiency of the system in a production mode.

Citation Download Citation

Florent Gapin, Bernard Le-Peutrec, Laurent Stock, and Marc Hanotte "Evaluation of a new photoresist dispense system to detect coating variation", Proc. SPIE 7272, Metrology, Inspection, and Process Control for Microlithography XXIII, 72723L (23 March 2009); https://doi.org/10.1117/12.816117

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KEYWORDS

Semiconducting wafers

Coating

Critical dimension metrology

Photoresist materials

Inspection

Intelligence systems

Chemistry

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