Productivity improvement in the wafer backside cleaning before exposure

S. Nishikido; T. Kitano; Y. Tokunaga; Marlene Strobl; Yu Chen Lin

doi:10.1117/12.814021

1 April 2009 Productivity improvement in the wafer backside cleaning before exposure

S. Nishikido, T. Kitano, Y. Tokunaga, Marlene Strobl, Yu Chen Lin

Proceedings Volume 7273, Advances in Resist Materials and Processing Technology XXVI; 72730V (2009) https://doi.org/10.1117/12.814021
Event: SPIE Advanced Lithography, 2009, San Jose, California, United States

Abstract

In the photolithography process, with the miniaturization of pattern size, depth of focus (D.O.F) is also becoming smaller and smaller. This indicates that the control of particles on the wafer backside which has not been regarded as a problem so far is becoming important. Therefore, we considered that wafer backside is cleaned just before a wafer is transferred into the exposure equipment in order to prevent the occurrence of a Focus error and reduce the contamination of the exposure chuck. As a result, it was verified that the cleaning of wafer backside at the memory production line of the 70nm node can reduce the contamination of the exposure chuck and can extend the period of maintenance for the exposure equipment. Moreover, it was also verified that the cleaning of wafer backside can improve productivity.

Citation Download Citation

S. Nishikido, T. Kitano, Y. Tokunaga, Marlene Strobl, and Yu Chen Lin "Productivity improvement in the wafer backside cleaning before exposure", Proc. SPIE 7273, Advances in Resist Materials and Processing Technology XXVI, 72730V (1 April 2009); https://doi.org/10.1117/12.814021

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