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16 March 2009 Process transfer strategies between ASML immersion scanners
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A top challenge for Photolithographers during a process transfer involving multiple-generation scanners is tool matching. In a more general sense, the task is to ensure that the wafer printing results in the receiving fab will match or even exceed those of the originating fab. In this paper we report on two strategies that we developed to perform a photo process transfer that is tailored to the scanner's capabilities. The first strategy presented describes a method to match the CD performance of the product features on the transferred scanner. A second strategy is then presented which considers also the down-stream process tools and seeks to optimize the process for yield. Results presented include: ASML TWINSCANTM XT:1700i and XT:1900i scanners 1D printing results from a line-space test reticle, parametric sensitivity calculations for the two scanners on 1D patterns, simulation predictions for a process-optimized scanner-matching procedure, and final wafer results on 2D production patterns. Effectiveness of the optimization strategies was then concluded.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yuan He, Peter Engblom, Jianming Zhou, Eric Janda, Anton Devilliers, Bernd Geh, Erik Byers, Jasper Menger, Steve Hansen, and Mircea Dusa "Process transfer strategies between ASML immersion scanners", Proc. SPIE 7274, Optical Microlithography XXII, 72742P (16 March 2009);

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