Paper
12 March 2009 Score-based fixing guidance generation with accurate hot-spot detection method
Yong-Hee Park, Dong-Hyun Kim, Jung-Hoe Choi, Ji-Suk Hong, Chul-Hong Park, Sang-Hoon Lee, Moon-Hyun Yoo, Jun-Dong Cho
Author Affiliations +
Abstract
While predicting and removing of lithographic hot-spots are a matured practice in recent semiconductor industry, it is one of the most difficult challenges to achieve high quality detection coverage and to provide designer-friendly fixing guidance for effective physical design implementation. In this paper, we present an accurate hot-spot detection method through leveling and scoring algorithm using weighted combination of image quality parameters, i.e., normalized image log-slope (NILS), mask error enhancement factor (MEEF), and depth of focus (DOF) which can be obtained through lithography simulation. Hot-spot scoring function and severity level are calibrated with process window qualification results. Least-square regression method is used to calibrate weighting coefficients for each image quality parameter. Once scoring function is obtained with wafer results, it can be applied to various designs with the same process. Using this calibrated scoring function, we generate fixing guidance and rule for the detected hot-spot area by locating edge bias value which can lead to a hot-spot free score level. Fixing guidance is generated by considering dissections information of OPC recipe. Finally, we integrated hot-spot fixing guidance display into layout editor for the effective design implementation. Applying hot-spot scoring and fixing method to memory devices of the 50nm node and below, we could achieve a sufficient process window margin for high yield mass production.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yong-Hee Park, Dong-Hyun Kim, Jung-Hoe Choi, Ji-Suk Hong, Chul-Hong Park, Sang-Hoon Lee, Moon-Hyun Yoo, and Jun-Dong Cho "Score-based fixing guidance generation with accurate hot-spot detection method", Proc. SPIE 7275, Design for Manufacturability through Design-Process Integration III, 72750P (12 March 2009); https://doi.org/10.1117/12.811840
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KEYWORDS
Optical proximity correction

Lithography

Semiconducting wafers

Calibration

Optical lithography

Nanoimprint lithography

Image quality

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